학술논문

Evaluation of test strategies for multichip modules
Document Type
Conference
Source
[1992] Proceedings. Fifth Annual IEEE International ASIC Conference and Exhibit ASIC Conference and Exhibit, 1992., Proceedings of Fifth Annual IEEE International. :234-237 1992
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Multichip modules
Circuit testing
Integrated circuit interconnections
Pins
Logic testing
Built-in self-test
Clocks
Test pattern generators
Packaging
Costs
Language
Abstract
Two parallel testing strategies for multichip modules-the boundary-scan technique and the cascadable built-in tester (CBIT)-are evaluated in terms of testing time, fault coverage, and area overhead. Results on a small-scale processor configuration favor the CBIT design for test effectiveness of the chip, and the boundary-scan design for area overhead interconnection tests.ETX