학술논문
Batch micropackaging by compression-bonded wafer-wafer transfer
Document Type
Conference
Author
Source
Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) Micro electro mechnical systems Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on. :482-489 1999
Subject
Language
ISSN
1084-6999
Abstract
Wafer-wafer transfer of microstructures is demonstrated by gold bump compression bonding. The process is performed at room temperature; 300/spl deg/C-plus is tolerated subsequently. 4-/spl mu/m bump bonds, transferred polysilicon resonators, vacuum-sealed micropackages, and getter structures have been fabricated, as well as multi-level structures built up by successive aligned transfers. Pull strengths of approximately 7/spl times/10/sup 7/ Pa have been measured. 95% yield has been observed in chip-scale transfers, across multiple designs. Sealed micro-packages tolerate external pressures of at least 7.2/spl times/10/sup 6/ Pa without leakage or observable damage.