부산대학교 도서관

3-D ICs can continue to improve power, performance, area, and cost beyond traditional Moore’s law scaling limitations by leveraging the third dimension and short vertical interconnects. Several recent studies present methodologies to implement 3-D ICs, but most of these studies implement each tier separately after partitioning a design into multiple tiers, resulting in inaccurate buffer insertion, which becomes more severe in advanced technology nodes. In this article, we present a new methodology called “Cascade2D flow” which utilizes design and microarchitecture insight for tier partitioning and implements 3-D ICs using 2-D commercial tools. By modeling vertical interconnects with sets of anchor cells and dummy wires, Cascade2D flow places, and routes and optimizes multiple tiers simultaneously in the 2-D version of a 3-D IC called “cascade2D design,” which enables accurate buffer insertion. Two flavors of 3-D ICs—monolithic 3-D (M3D) and face-to-face-bonded (F2F-bonded) 3-D ICs—of a commercial in-order, 32-bit application processor at foundry 28 nm, 14/16 nm, and predictive 7-nm technology nodes are implemented using this new methodology. We investigate the power, performance and area improvements of 3-D ICs over the 2-D counterparts to examine the efficacy of the methodology. Our new methodology outperforms the state-of-the-art 3-D IC design flows in the both flavors of 3-D ICs with up to $4\times $ better power savings. In the best case, 3-D ICs from Cascade2D flow show 25% better performance at iso-power and 20% lower power at iso-performance.