학술논문

FEGAN: A Feature-Oriented Enhanced GAN for Enhancing Thermal Image Super-Resolution
Document Type
Periodical
Source
IEEE Signal Processing Letters IEEE Signal Process. Lett. Signal Processing Letters, IEEE. 31:541-545 2024
Subject
Signal Processing and Analysis
Computing and Processing
Communication, Networking and Broadcast Technologies
Training
Feature extraction
Iron
Image reconstruction
Image edge detection
Imaging
Measurement
Generative adversarial network (GAN)
super-resolution
feature enhancement
thermal imaging
Language
ISSN
1070-9908
1558-2361
Abstract
Infrared thermal imaging presents significant potential in various domains. However, the widespread development of this technology is hindered by the high cost associated with acquiring high-quality thermal imaging sensors. To overcome this challenge, super-resolution techniques have emerged as a viable solution for extracting valuable information from low-resolution thermal images. While generative adversarial networks (GANs) have been widely adopted for thermal imaging super-resolution, their performance is limited by the inherent lack of detail in low-resolution training images, resulting in reduced fidelity and accuracy in generating high-resolution reconstructions. To tackle this challenge, this letter introduces FEGAN, a novel approach that enhances the performance of GANs by incorporating a feature-oriented enhanced (FE) mechanism within the generative network (GN). The FE plays a pivotal role in extracting high-frequency texture and edge details from low-resolution inputs and reconstructing them into enhanced images. This process substantially improves textures and edges within the training set of thermal images. Furthermore, refinements have been applied to both the GN and the discriminative network (DN) to enhance feature extraction efficiency. The experimental findings unequivocally demonstrate the superior performance of FEGAN compared to state-of-the-art methods. FEGAN achieves impressive performance metrics, including PSNR of 27.18, SSIM of 0.6523, FSIM of 0.5500, and LPIPS of 0.1221, highlighting its remarkable capabilities in the realm of thermal image super-resolution.