학술논문

Analog/RF Performance and Optimization of Vertical III–V Double-Gate Transistor
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 60(5):1613-1618 May, 2013
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Parasitic capacitance
Radio frequency
Analog/RF
double-gate (DG)
parasitic capacitance
parasitic resistance
underlap
Language
ISSN
0018-9383
1557-9646
Abstract
Parasitics engineering on a GaAs vertical transistor is analyzed. Through separate control of source/drain (S/D) spacer and underlap, the individual impact of the parasitic components is unveiled. Thicker S/D spacer improves $f_{\rm T}$, $f_{\max}$ by reducing parasitic capacitance. Increased source-side underlap improves output resistance and gain as the virtual source point is shifted. Increased drain-side underlap improves $f_{\max}$ by reducing parasitic capacitance. Optimization of different analog/RF metrics can be easily implemented through asymmetric S/D spacer/underlap design in a vertical transistor.