학술논문
S2-T6: Microchannel cooled, high power GaN-on-Diamond MMIC
Document Type
Conference
Author
Source
2014 Lester Eastman Conference on High Performance Devices (LEC) Lester Eastman Conference on High Performance Devices (LEC), 2014. :1-5 Aug, 2014
Subject
Language
Abstract
In this work, we report on an innovative approach which integrates GaN-on-Diamond microstrip MMICs with a state-of-the-art microchannel cooler and provides a significant thermal advantage for high power GaN applications. Specifically, we describe efforts to develop a wide bandwidth, GaN-on-Diamond MMIC power amplifier that achieves greater than 3x RF power density compared to GaN on SiC while operating at a MMIC heat flux of >1kW/cm 2 and maintaining junction temperatures below the estimated targets to achieve 10 6 hrs lifetime by employing a high performance, liquid phase, microchannel cooler capable of a volumetric heat dissipation rate of >10kW/cm 3 . To date, no prior work has been reported for GaN-on-Diamond microstrip MMICs.