학술논문

Run-to-run control of CMP process considering aging effects of pad and disc
Document Type
Conference
Source
1999 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat No.99CH36314) Semiconductor manufacturing Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on. :229-232 1999
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Process control
Aging
Atherosclerosis
Planarization
Chemical technology
Abrasives
Rough surfaces
Surface roughness
Statistics
Semiconductor process modeling
Language
ISSN
1523-553X
Abstract
CMP processes are known to be erratic and unstable. A simple control strategy is to predict the run-to-run process removal rate and then adjust the processing time based on the prediction. EWMA and PCC techniques are two most often used prediction techniques. In this work, we revise the PCC design to take into account the ages of the abrasive pad and conditioning disc. It is shown that the proposed age-based technique can significantly improve the prediction capability and, thus, the control efficiency over conventional techniques.