학술논문
Improvement of Encapsulation Technique of Organic Photovoltaics by UV-Curable Adhesive
Document Type
Periodical
Source
IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 23(2):281-286 Jun, 2023
Subject
Language
ISSN
1530-4388
1558-2574
1558-2574
Abstract
This study develops a low-cost UV adhesive as a sealant and the associated encapsulation architecture, highly improving the stability of organic photovoltaic (OPV) device. In detail, this present study demonstrates how the composition and additive in the UV adhesive as a sealant affect the OPV stability. The face sealing and UV adhesive enable the OPV device to successfully meet three industrial criteria of accelerated tests of OPV stability: (1) T80 lifetime is more than 1000 h under the damp heat test of 65 °C/65% relative humidity (RH) environment, (2) T80 lifetime is more than 1000 h under the damp heat test of 85 °C/85% RH environment, and (3) T80 lifetime is larger than 1000 h under the continuous AM 1.5G solar illumination (i.e., light-soaking test).