학술논문

Electrical Characteristics of Magnesium Doped a-IGZO RRAM: Chemical Vapor Deposition using Enhanced Atmospheric Pressure-Plasma
Document Type
Conference
Source
2020 IEEE Eurasia Conference on IOT, Communication and Engineering (ECICE) IOT, Communication and Engineering (ECICE), 2020 IEEE Eurasia Conference on. :121-124 Oct, 2020
Subject
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Fields, Waves and Electromagnetics
General Topics for Engineers
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Electric variables
Electrodes
Nonvolatile memory
Doping
Current measurement
Insulators
Voltage measurement
IGZO
Mg dopant
RRAM and AP-PECVD
Language
Abstract
Since the first floating gate memory was introduced in 1968, Non-Volatile Memory (NVM) has been widely investigated and developed for permanent data storage. The progress of metal oxide semiconductor field-effect transistor (MOSFET) technology even makes the memory scalable. The scale-down of the memories faces other issues. The thinner oxide layer induces a higher leakage current and worse electrical characteristics. There are promising NVMs such as ferroelectric (FeRAM), phase-change (PCRAM), magneto-resistive (MRAM), and resistive (RRAM).In this study, RRAM devices with a metal-insulator-metal (MIM) structure are investigated. Amorphous indium gallium zinc oxide (a-IGZO) is deposited with atmosphere pressure-plasma enhanced chemical vapor deposition (AP-PECVD). The resistivity of an a-IGZO insulator is dominated by oxygen vacancy, and the electrical characteristics of RRAM devices are crucially influenced by the insulator layer. Magnesium (Mg) is doped into an a-IGZO insulator layer to modulate the RRAM device's electrical characteristics. The results show that 1% of Mg doping makes the stability progress on devices set and read process. If more Mg is doped into a-IGZO insulator layer, Mg occupies more oxygen vacancies, and RRAM devices become more unstable and unreliable.