학술논문
FC Cu pillar package development for broad market applications
Document Type
Conference
Author
Source
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :609-614 May, 2015
Subject
Language
ISSN
0569-5503
2377-5726
2377-5726
Abstract
Over recent years, Flip Chip Technology has gained significant momentum as a major assembly technology for the semiconductor industry. And momentum is increasing as there is a strong need to expand flip chip applications to align with an evolving and dynamic market. As a result, our industry has seen many different configurations of FC packaging, and is constantly pushing boundaries and innovation to meet complex device requirements.