학술논문

Near-Optimal Scheduling for IC Packaging Operations Considering Processing-Time Variations and Factory Practices
Document Type
Periodical
Source
IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(4):3878-3885 Apr, 2024
Subject
Robotics and Control Systems
Computing and Processing
Components, Circuits, Devices and Systems
Production
Job shop scheduling
Feature extraction
Integrated circuit packaging
Production facilities
Processor scheduling
Predictive models
Semiconductor manufacturing
IC packaging process
near-optimal scheduling
rush-order
dynamic scheduling
Language
ISSN
2377-3766
2377-3774
Abstract
Due to the short life cycles of electronic products, trial run lots of new products are crucial in IC packaging for production verification and engineering adjustments. The processing time of trial run lots may differ significantly from production lots due to engineering adjustments and is difficult to predict without sufficient historical data. The purpose of this letter is to develop a framework for near-optimal scheduling of IC packaging considering processing time variations and factory practices. Using an orthogonal greedy algorithm and recurrent neural network, this framework extracts key features and predicts the processing times of trial run lots and production lots for each operation using these algorithms. After formulating the scheduling problem in an integer linear programming form, an ordinal optimization method is embedded within the decomposition and coordination framework to obtain dynamic and near-optimal schedules in a computationally efficient manner. This approach can improve the efficiency of IC packaging and potentially other operations by optimizing lot scheduling, reducing production tardiness, and increasing productivity in the factory, paving the way for self-optimizing factories in the future.