학술논문

High-Work-Function Ir/HfLaO ${\rm p}$-MOSFETs Using Low-Temperature-Processed Shallow Junction
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 55(3):838-843 Mar, 2008
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Hafnium compounds
Junctions
MOSFET circuits
Silicon
Logic gates
Nickel
Metals
HfLaO
solid phase diffusion
ultrashallow junction
Language
ISSN
0018-9383
1557-9646
Abstract
We report a high effective work function (${\bm \phi}_{{\bf m}\hbox{-}{\bf eff}}$) and a very low $V_{t}$ Ir gate on HfLaO ${\rm p}$-MOSFETs using novel self-aligned low-temperature shallow junctions. This gate-first process has shallow junctions of 9.6 or 20 nm that are formed by solid phase diffusion using $\hbox{SiO}_{2}$-covered Ga or Ni/Ga. At 1.2-nm effective oxide thickness, good ${\bm \phi}_{{\bf m}\hbox{-}{\bf eff}}$ of 5.3 eV, low $V_{t}$ of ${+}\hbox{0.05}$ V, high mobility of 90 cm$^{2}$/V $\cdot$s at ${-}\hbox{0.3}$ MV/cm, and small 85 $^{\circ}$C negative bias-temperature instability (NBTI) of 20 mV (10 MV/cm for 1 h) are measured for Ir/HfLaO ${\rm p}$-MOSFETs.