학술논문
Low-profile ultra-wideband array design based on dielectric layer loading
Document Type
Conference
Author
Source
2021 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM) Electromagnetics: Applications and Student Innovation Competition (iWEM), 2021 IEEE International Workshop on. volume1:1-3 Nov, 2021
Subject
Language
Abstract
In the paper, a new ultra-wideband tightly coupled antenna array (TCA) is designed. The array unit is mainly based on the traditional Vivaldi antenna structure, to which trapezoidal slots are added and metal vias are used to extend the radiating arms, thus forming a flat plate coupling capacitor to reduce the overall profile height of the antenna. The wide foot matching layer is placed on top of the antenna, and T-slots are added on both sides of the Vivaldi opening to increase the resonance point and widen the bandwidth. This unit is formed into an array, and the array takes the form of a uniform planar array. Based on the above improved dielectric layer loading low-profile array can achieve VSWR85% in the full band.