학술논문

Transient current modeling & power delivery analysis for next gen chipset core

Document Type

Conference

Author

Fern Nee Tan; Aissa Chai; Sze Geat Pang; Dhinesh Sasidaran; Kiat Hong Ng; Song Chin Deo; Chee Siong Lee; Jin Sean Lim; Poey Ling Ooi; Chee Ngai Loke; Meng Chong Lim

Source

2007 International Conference on Electronic Materials and Packaging Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on. :1-23 Nov, 2007

Subject

Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Transient analysis

Language

Online Access

Full Text (IEEE) Find it@PNU

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