학술논문
Crosstalk analysis of multigigabit links on high density interconnects PCB using IBIS AMI models
Document Type
Conference
Author
Source
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE. :223-226 Dec, 2012
Subject
Language
ISSN
2151-1225
2151-1233
2151-1233
Abstract
This study presents the use of a design flow and remarkable results of signal integrity crosstalk simulations of Multi-GigaHertz serial links in high density printed circuit boards, which becomes mandatory due to increase of data rates.