학술논문

Reliability challenges in Forksheet Devices: (Invited Paper)
Document Type
Conference
Source
2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-8 Mar, 2023
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Performance evaluation
Silicon compounds
Semiconductor device reliability
Capacitors
Computer architecture
Threshold voltage
Dielectrics
Forksheet FETs
FSH
BDI
Nanosheet FETs
NSH
hot-carrier degradation
HCD
trapping
oxide defects
FET arrays
bottom dielectric isolation
Language
ISSN
1938-1891
Abstract
The forksheet (FSH) device architecture is a possible candidate towards continued logic cell downscaling. It consists of vertically stacked n- and p-type sheets at opposing sides of a dielectric wall. In this work, we overview the time-0 and time-dependent performance of n and p-type FSH field-effect transistors co-integrated with nanosheets (NSH) in individual wafers. A separate assessment of dedicated capacitors yields indications of a non-negligible effect of negative fixed charges trapped in low-temperature deposited SiO 2 , currently used as dielectric wall liner. Finally, we evaluate the impact of using a bottom dielectric isolation (BDI) instead of a junction-based electrical isolation of the sheets from the substrate.