학술논문

Characterization of Sub-micron Metal Line Arrays Using Picosecond Ultrasonics
Document Type
Conference
Source
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2020 31st Annual. :1-6 Aug, 2020
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Metals
Acoustic beams
Finite element analysis
Probes
Acoustics
Laser excitation
Acoustic measurements
Pattered Nanostructure
Acoustic Metrology
Picosecond Ultrasonics
Nanoelectronic Memory and Logic Devices
Language
ISSN
2376-6697
Abstract
Characterization of patterned nanostructures in modern nanoelectronic memory and logic devices using traditional optical critical dimension (OCD) metrology technique faces challenges as the structures become optically opaque. In this paper, we present the picosecond ultrasonic (PU) based acoustic metrology technique as a viable option to characterize periodically patterned nanostructures. Specifically, we evaluate the sensitivity of PU to metal line arrays of various geometries and show that the frequency profile of generated acoustics is dependent on the sample geometry including the pitch and width of the metal lines exposed. We also demonstrate that the signal is sensitive to the presence of the lines embedded under a blanket layer of the same metal.