학술논문

CMOS THz transmissive imaging system
Document Type
Conference
Source
2014 IEEE Asian Solid-State Circuits Conference (A-SSCC) Solid-State Circuits Conference (A-SSCC), 2014 IEEE Asian. :169-172 Nov, 2014
Subject
Components, Circuits, Devices and Systems
CMOS integrated circuits
Imaging
Antenna arrays
CMOS technology
Detectors
Solid state circuits
Lenses
THz imaging system
CMOS
signal source
signal sensor
System-on-Package (SoP)
Language
Abstract
This paper presents a THz imaging system composed of a signal source and a signal sensor in CMOS technology. The signal source integrates a 338 GHz oscillator in 40-nm CMOS and an antenna array on a Benzocyclobutene (BCB) carrier using the SoP (System-on-Package) technique. The measured EIRP achieves +8 dBm. The signal sensor is implemented in 0.18 μm CMOS. The measured maximum responsivity is 632 kV/W at 332 GHz. The signal source and signal sensor consume dc power of 37.5 mW and 7.92 mW, respectively. The resolution of the proposed THz imaging system is 4 mm.