학술논문

SU-8 flexible ribbon cable for biomedical microsystem interconnection
Document Type
Conference
Source
2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on. :622-625 Feb, 2011
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Integrated circuit interconnections
Bonding
Silicon
Spirals
Copper
SU-8
Flexible spiral ribbon cable
Stress release
Au-Au Thermocompressive bonding
Heterogeneous integration
Language
Abstract
The paper presents a flexible interconnecting scheme with a wafer-level process to fabricate a SU-8 flexible ribbon cable for biomedical microsystem interconnection. Combining with a low temperature Au-Au thermocompressive bond (