학술논문

Microwave Effects on Metal–Semiconductor Contact of Heavily Nitrogen-Implanted Silicon
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(2):991-996 Feb, 2024
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Silicon
Nitrogen
Semiconductor device measurement
Metals
Substrates
Rapid thermal annealing
Tunneling
Annealing
dopant activation
microwave annealing (MWA)
nitrogen-implanted (N-implanted) silicon
rapid thermal annealing (RTA)
Language
ISSN
0018-9383
1557-9646
Abstract
Nitrogen-implanted (N-implanted) silicon was employed to examine the microwave effects because of the dipole-like defects formed by implanted ions. The defects spread through an insulator-to-conductor transition depending on annealing conditions. Rapid thermal annealing (RTA) and microwave annealing (MWA) are investigated. MWA unexpectedly improved insulating ability of implanted nitrogen impurities in silicon, while RTA made metal–semiconductor (MS) contact ohmic-like. The sheet resistance ( ${R}_{\text {s}}{)}$ , Hall measurement, ${I}$ – ${V}$ curve of metal–semiconductor–metal (MSM) junction, Fourier-transform infrared spectroscopy (FTIR), grazing incidence X-ray diffraction (GIXRD), and secondary ion mass spectrometry (SIMS) were used to characterize the microwave effects in electrical and IR spectrum. The results showed that the MS contact behavior of the titanium/silicon junction could be tuned, which is ideal for fabricating selector-like devices due to the similar MSM structure. Enhancement in turn-on voltage of MSM back-to-back Schottky diode implied that MWA could be a potential technology for device optimization.