학술논문
Throughput Optimization of Fast Processing Tools Using a Dispatching Algorithm
Document Type
Conference
Source
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2019 30th Annual SEMI. :1-5 May, 2019
Subject
Language
ISSN
2376-6697
Abstract
Throughput of certain fast processing tool sets in a semiconductor Fab is sometimes constrained by limitations of FOUP delivery system. The delivery system not being able to keep up with the tools result in a certain throughput loss. This throughput loss can be mitigated by staging the WIP close to tools. However, WIP staging has its limitations. This study presents a methodology to overcome these limitations by staging the WIP just in time for dispatching.