학술논문

Device Reliability to Circuit Qualification: Insights and Challenges
Document Type
Conference
Source
2022 IEEE International Integrated Reliability Workshop (IIRW) Integrated Reliability Workshop (IIRW), 2022 IEEE International. :1-7 Oct, 2022
Subject
Components, Circuits, Devices and Systems
Degradation
Temperature sensors
Semiconductor device modeling
Performance evaluation
Temperature dependence
Silicon-on-insulator
Computer architecture
Wearout
Bias Temperature Instabilities
Hot carriers
Hard Breakdown
damage interaction
HTOL
Language
ISSN
2374-8036
Abstract
Aging phenomena are first evidenced at device level to cell level considering a precise knowledge of the leading degradation mechanisms and interactions useful for processing optimization focusing performance vs. reliability requirements. Digital to analog circuits are then studied for product qualification based on the former results that needs specific methodologies adapted case by case with mission profile and the correlation between sensing parameter, accelerating factors for lifetime margin. This represents huge challenges for operational lifetime determination, considering top down and bottom up consistencies for relevant product qualification.