학술논문
Reducing the radiation from PCB cavities with a high-DK dielectric layer
Document Type
Conference
Author
Source
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE Electromagnetic Compatibility - EMC EUROPE, 2020 International Symposium on. :1-5 Sep, 2020
Subject
Language
ISSN
2325-0364
Abstract
A special layer of high-DK material is used to replace edge plating and/or via stitching connecting ground planes to suppress EMI and radiation from multilayer printed circuit boards. Electromagnetic leakage from gaps due to via-to via stitching and break-off tabs required in plating is minimized and overall cost is reduced. A test board is built, near field scan measurement and near to far field transformation is used to quantify the EMI suppression of the proposed high-DK layer vs. traditional via stitching. The results show comparable if not higher (up to 20dB) suppression of board edge radiation in a broadband frequency range.