학술논문

7nm FinFET technology heavy ion SEL evaluation using Xilinx Versal as case study
Document Type
Conference
Source
2021 21th European Conference on Radiation and Its Effects on Components and Systems (RADECS) Radiation and Its Effects on Components and Systems (RADECS), 2021 21th European Conference. :1-6 Sep, 2021
Subject
Aerospace
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Nuclear Engineering
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Performance evaluation
Temperature sensors
Single event latchup
Semiconductor lasers
Voltage
Ions
FinFETs
SoC
7nm FinFET
Versal
Xilinx
SEL
Heavy ion
Laser
Language
ISSN
1609-0438
Abstract
7nm FinFET is the last technology proposed by Xilinx and also for the first Adaptive Compute Acceleration Platform (ACAP). It is the successor of the commonly used System on Chip (SoC) Zynq XC7Z030, and more recently the Zynq® Ultrascale+. The Newspace industry is continuously requiring more performance capability and a better figure of merit regarding volume, mass and consumption. For space applications, one of the key metric is the radiation hardness of such devices. It needs to be carefully considered, to avoid reliability issues, and bad performance about system availability. The 7nm FinFET technology has been then selected to manage these new challenges. This paper presents first the technology and its benefits. Then a description of the GANIL irradiation facility and the test bench developed to perform heavy ion SEE tests is described. The Xilinx Versal device preparation for heavy ion campaign is also explained. Results and observations about Single Event Latchups (SEL) and other events are also presented. Furthermore, a laser test to localize observed events under beam is also described.