학술논문
Reliability of Heterogeneous Integration on Hybrid Substrate With Ajinomoto Build-Up Film
Document Type
Conference
Author
Source
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :542-547 May, 2023
Subject
Language
ISSN
2377-5726
Abstract
The hybrid substrate (build-up package substrate + organic interposer + solder joints + underfill) of 2.3D IC integration (or multiple systems and heterogeneous integration) is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with two different kinds of dielectric materials, namely the PID (photoimageable dielectric) and the ABF (Ajinomoto Build-Up Film). These two hybrid substrates are supporting two chips. The flatness of metal lines of the RDLs (redistribution-layers), the quality of the hybrid substrate after chip-to-hybrid substrate bonding, and the reliability of the solder joints between these two hybrid substrates will be presented.