학술논문
Inline Failure Analysis of Sintered Layers in Power Modules using Infrared Thermography
Document Type
Conference
Author
Source
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-7 Apr, 2022
Subject
Language
Abstract
In this study we demonstrate the capabilities of pulsed infrared thermography (PIRT) for the inspection of sintered and soldered chip interconnections. Furthermore, this work will present a PIRT system for failure analysis (FA) which is integrated to a soldering or sintering machine without the need of spray coating for industrial inspections of electronic components such as power modules. For the selection of the suitable components for the PIRT system, initial FA studies were carried out by means of infrared (IR) thermography on exemplary setups with sintered and soldered layers. Hardware and measurement parameter specifications for the IR failure analysis system are defined and first in-line system design is provided.