학술논문

Heat Sinking, Crosstalk, and Temperature Uniformity for Large Close-Packed Microcalorimeter Arrays
Document Type
Periodical
Source
IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 19(3):557-560 Jun, 2009
Subject
Fields, Waves and Electromagnetics
Engineered Materials, Dielectrics and Plasmas
Heat sinks
Crosstalk
Temperature
Shape
Pulse shaping methods
Convolution
Electrothermal effects
Feedback
Copper
Silicon
Microcalorimeters
transition-edge sensors
x-ray spectroscopy
Language
ISSN
1051-8223
1558-2515
2378-7074
Abstract
In a large close-packed array of x-ray microcalorimeters, sufficient heat sinking is important to minimize thermal crosstalk between pixels and to make the bath temperature of all the pixels uniform. We have measured crosstalk in our 8 $\times$ 8 pixel arrays. The shapes of the thermal crosstalk pulses are reproduced well as a convolution of heat input from the source pixel and the thermal decay in the receiver pixel. The amount of the thermal crosstalk is clearly dependent on the degree of electrothermal feedback. We have compared the magnitude of thermal crosstalk with and without a heat-sinking copper layer on the backside of the silicon frame as a function of distance between the source and receiver pixels. Using the results obtained, we have estimated the degradation of energy resolution that is expected as a function of count rate. We have also studied the temperature distribution within an array due to continuous heating from the TES bias to estimate impacts on the uniformity of the pixel performance.