학술논문
Coupled 3D electromagnetic, structural, and thermal finite element analysis as integral components of electronic product design
Document Type
Conference
Author
Source
Wescon/96 WESCON/96. :358-364 1996
Subject
Language
ISSN
1095-791X
Abstract
Electronic product design is aided by coupled electromagnetic, structural, and thermal finite element analysis. Coupled electromagnetic and structural finite elements can predict motion vs. time in relays and in microelectromechanical systems (MEMS). Coupled electromagnetic and thermal finite elements can predict the temperature distributions in electronic packages.