학술논문

Micro-transfer-printing for heterogeneous integration
Document Type
Conference
Source
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :34-34 May, 2019
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Photonics
Silicon
Substrates
Surface treatment
Dielectrics
Polymers
III-V semiconductor materials
Language
Abstract
Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different materials and devices. The technique is particularly applicable to photonics where a typical system requires diverse arrays of components.