학술논문

XeHPC Ponte Vecchio
Document Type
Conference
Author
Source
2021 IEEE Hot Chips 33 Symposium (HCS) Hot Chips 33 Symposium (HCS), 2021 IEEE. :1-34 Aug, 2021
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Computational modeling
Packaging
Software
Language
ISSN
2573-2048
Abstract
500X Increase In Compute Performance Scalable Compute & Memory Packaging & Interconnect For Density & Scale Full Software Stack/Programming Model