학술논문

Analysis of Lateral Thermal Coupling for GaN MMIC Technologies
Document Type
Periodical
Source
IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 66(10):4430-4438 Oct, 2018
Subject
Fields, Waves and Electromagnetics
Temperature measurement
Temperature sensors
Heating systems
Semiconductor device measurement
Gallium nitride
Couplings
Gallium nitride (GaN)
heat spread
lateral coupling
semiconductor resistor
thermal sensors
Language
ISSN
0018-9480
1557-9670
Abstract
This paper presents a study of the lateral heat propagation in an aluminum gallium nitride/gallium nitride (AlGaN/GaN) heterostructure grown on a silicon carbide substrate. The study is enabled by the design of a temperature sensor that utilizes the temperature-dependent $I$ – $V$ characteristic of a semiconductor resistor, making it suitable for integration in GaN monolithic microwave integrated circuit technologies. Using the sensor, we are able to characterize the thermal transient response and extract lateral thermal time constants from the measurements. Time constants in the range from 25 $\mu \text{s}$ to 1.2 ms are identified. Furthermore, the heat propagation properties are characterized for heat source-to-sensor distances of 86– $484~\mu \text{m}$ , resulting in delay times from 3.5 to $111~\mu \text{s}$ . It is shown that both the time constants and propagation delay increase with temperature. An empirical model of the sensor current versus temperature and voltage is proposed and used to predict the junction temperature of the sensor. The study provides knowledge for heat management design and proposes an integrated temperature measurement solution for future highly integrated GaN applications.