부산대학교 도서관

In order to build large array pixel detectors for future experiments in High Energy Physics e.g. for experiments at the Large Hadron Collider (LHC) at CERN, one needs to construct easy to handle and manufacturable able modules which can be used to put together to big detector systems. Diode- (pixel-) arrays can be fabricated in wafer size dimensions (currently about 8 cm in length); read our chips have dimensions of about 1 cm/sup 2/. A natural (but not trivial) thing would be to use the silicon diode array as the basic building block for a detector system. Several read out chips have to be bonded onto this module. For easy module interconnections the data lines, control lines, and power distributions have to be connected to the periphery of the module. To avoid complicated wiring, all lines should be integrated onto the detector substrate. Such a module could be made using multichip module (MCM) technology. Some electrical considerations of such a module and possible realizations are discussed.