학술논문
“FlexTrate ^TM” — Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP
Document Type
Conference
Author
Source
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :649-654 May, 2017
Subject
Language
ISSN
2377-5726
Abstract
We have developed a novel fan-out wafer level packaging (FOWLP) technology for high-performance and scalable flexible and biocompatible substrates that we call FlexTrate (TM). We demonstrate the technology with the assembly of 1-mm-sqaure 625 (25 by 25) Si dielets on a biocompatible Polydimethylsiloxane (PDMS). By using the new FOWLP technology, die-die interconnects with a pitch of 10 mm or less were implemented on the array of the Si dielets embedded in the PDMS.