학술논문

Angled Flip-Chip Integration of VCSELs on Silicon Photonic Integrated Circuits
Document Type
Periodical
Source
Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 40(15):5190-5200 Aug, 2022
Subject
Communication, Networking and Broadcast Technologies
Photonics and Electrooptics
Couplings
Vertical cavity surface emitting lasers
Optical waveguides
Optical feedback
Gratings
Diffraction
Diffraction gratings
Coupling efficiency
flip-chip integration
optical feedback
silicon-nitride photonic integrated circuit
vertical-cavity surface-emitting laser
Language
ISSN
0733-8724
1558-2213
Abstract
An investigation of angled flip-chip integration of a singlemode 850 nm vertical-cavity surface-emitting laser (VCSEL) on a silicon nitride photonic integrated circuit (PIC) is presented. Using numerical FDTD simulations, we consider the conditions under which the VCSEL can be integrated at an angle over a grating coupler with high coupling efficiency and low optical feedback. With both coupling efficiency and feedback decreasing with increasing angle, there is a trade-off. With co-directional coupling, first-order diffraction loss sets in at a critical angle, which further reduces the coupling efficiency. No such critical angle exists for contra-directional coupling. We also experimentally demonstrate angled flip-chip integration of GaAs-based 850 nm single transverse and polarization mode VCSELs over grating couplers on a silicon-nitride PIC. At the output grating coupler, light is either collected by an optical fiber or converted to a photocurrent using a flip-chip integrated GaAs-based photodetector. The latter forms an on-PIC optical link. We measured an insertion loss of 21.9, 17.6 and 20.1 dB with a singlemode fiber, multimode fiber and photodetector over the output grating coupler, respectively.