학술논문

Modeling the Electrical Degradation of Micro-transfer-Printed 845 nm VCSILs for Silicon Photonics
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(2):1131-1138 Feb, 2024
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Vertical cavity surface emitting lasers
Degradation
Resistance
Stress
Impurities
Substrates
Optical reflection
diffusion
impurities
silicon photonics (SiPh)
vertical-cavity silicon-integrated laser (VCSIL)
Language
ISSN
0018-9383
1557-9646
Abstract
This article deals for the first time with the electrical degradation of novel 845 nm vertical-cavity silicon-integrated lasers (VCSILs) for silicon photonics (SiPh). We analyzed the reliability of these devices by submitting them to high current stress. The experimental results showed that stress induced: 1) a significant increase in the series resistance, occurring in two separated time-windows and 2) a lowering of the turn-on voltage. To understand the origin of such degradation phenomena, we simulated the ${I}$ - ${V}$ characteristics and the band diagrams by a Poisson-drift-diffusion simulator. We demonstrated that the degradation was caused by the diffusion of mobile species capable of compensating the p-type doping. The diffusing species are expected to migrate from the p-contact region in the top distributed Bragg reflector (DBR) towards the active layers.