학술논문
Raman Spectroscopy and Hyperspectral Imaging for Wafer-On-Wafer (WOW) Processing
Document Type
Conference
Author
Source
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022
Subject
Language
ISSN
2150-5942
Abstract
The application of Raman spectroscopy to the silicon device manufacturing process was investigated for the first time. Confocal Raman imaging is a non-contact, non-destructive technique, which can be used for 3D-imaging of semiconductors. The depth resolution is particularly important for stacked devices, such as wafer-on-wafer. Further, Raman can visualize residual stress in the devices, which influences reliability of the final chip. Organic residues and contaminants are easily identified in the Raman spectra as well.