학술논문
Ultra-thin Si chips for flexible electronics Process technology, characterization, assembly and applications
Document Type
Conference
Author
Source
28th Symposium on Microelectronics Technology and Devices (SBMicro 2013) Microelectronics Technology and Devices (SBMicro), 2013 Symposium on. :1-3 Sep, 2013
Subject
Language
Abstract
Various aspects of ultra-thin chip technology for flexible electronics are presented and discussed, including ultra-thin-chip fabrication, mechanical and electrical characterization, as well as chip assembly and imbedding. A stress sensor based on a stack of two ultra-thin, flexible CMOS chips indicates the particular advantages of the Chipfilm™ process technology, which is subject of this paper, when compared to other kinds of thin-chip fabrication.