부산대학교 도서관

This paper presents planar thick film components and their practical implementations to filters. Different thick film L/C component geometries were designed, printed on alumina, fired and characterized in the HF range. They were asymmetric to input and output terminations, and to positive and negative (or ground) applied voltages and HF signals. L-inductive, C-capacitive parameters were distributed using different planar thick film constructions: inductor windings were printed as the top electrode of capacitor and vice versa, planar capacitors were printed between the windings. As a result, the groups of components were realized on 0.5 inch /spl times/ 1 inch; 1 inch /spl times/ 1 inch alumina substrates as DIL (dual-in-line package) matrix to serve as filter arrays in EMI (Electromagnetic Interference) suppression.