학술논문

Coarse resolution defect localization algorithm for an automated visual printed circuit board inspection
Document Type
Conference
Source
IEEE 2002 28th Annual Conference of the Industrial Electronics Society. IECON 02 Industrial electronics society IECON 02 [Industrial Electronics Society, IEEE 2002 28th Annual Conference of the]. 4:2629-2634 vol.4 2002
Subject
Power, Energy and Industry Applications
Computing and Processing
Components, Circuits, Devices and Systems
Printed circuits
Inspection
Laminates
Etching
Manufacturing processes
Printing
Image resolution
Spine
Industrial electronics
Manufacturing industries
Language
Abstract
One of the backbones in electronic manufacturing industry is the printed circuit board (PCB) manufacturing. Current practice in PCB manufacturing requires etching process. This process is an irreversible process. Printing process, which is done before etching process, caused most of the destructive defects found on the PCB. Once the laminate is etched, the defects, if they exist would cause the PCB laminate to become useless. Due to the fatigue and speed requirement, manual inspection is ineffective to inspect every printed laminate. Therefore, manufacturers require an automated system to detect the defects online which may occur during the printing process. Hence, this paper proposes an algorithm for automated visual PCB inspection that is able to automatically detect and locate any defect on a PCB laminate. The defect is detected by utilizing wavelet-based image difference algorithm. The coarse resolution differenced image then is used in order to locate the defective area on the fine resolution tested PCB image.