학술논문

Packaged CMOS cryogenic characterization for quantum computing applications
Document Type
Conference
Source
2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS) Electronics, Circuits and Systems (ICECS), 2022 29th IEEE International Conference on. :1-4 Oct, 2022
Subject
Bioengineering
Components, Circuits, Devices and Systems
Computing and Processing
General Topics for Engineers
Geoscience
Robotics and Control Systems
Signal Processing and Analysis
Temperature measurement
Wrist
Semiconductor device modeling
MOSFET
Temperature
Wires
Cryogenics
Quantum Computer
Cryogenic temperature
Bulk CMOS
Language
Abstract
Most quantum computing platforms are nowadays operating at temperatures of a few Kelvin or lower, and their control and readout electronics are gradually brought close or to the same temperature stages. A pivotal step towards the design of such CMOS circuits is the NMOS and PMOS transistor characterization at cryogenic temperatures. While typically performed in cryogenic probe stations down to liquid helium temperature, the CMOS chip for quantum computing is cooled further along with the qubit sample in dilution refrigerators. Here we propose and discuss a wire-bonded and packaged CMOS characterization setup down to 10mK. Several NMOS and PMOS transistors with various aspect ratios of a 180nm CMOS series die were characterized, to develop a novel PDK model for circuit design.