학술논문
Ru Stress Assessment by Membrane Wrinkling for Interconnect Applications
Document Type
Conference
Author
Source
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023
Subject
Language
Abstract
The stress evolution of PVD Ruthenium (Ru) thin films is studied at relevant temperatures for interconnect processing. Wafer bow measurements, atomic force microscopy (AFM), scanning electron microscopy (SEM), microelectromechanical systems (MEMS) and the Föppl-von Kármán theory were used to determine the stress behavior of 5 to 50 nm thick films. We show that the local relaxation of PVD Ru film results in two regimes: bending and wrinkling, depending on stress and film thickness.