학술논문

Design Considerations for Spin Readout Amplifiers in Monolithically Integrated Semiconductor Quantum Processors
Document Type
Conference
Source
2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Radio Frequency Integrated Circuits Symposium (RFIC), 2019 IEEE. :111-114 Jun, 2019
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineering Profession
Fields, Waves and Electromagnetics
Transmission line measurements
Temperature measurement
Qubit
Semiconductor device measurement
MOSFET
MOSFET circuits
Logic gates
cryogenics
electron-spin
hole-spin
qubit
semiconductor quantum dot
silicon germanium
transimpedance amplifier
Language
ISSN
2375-0995
Abstract
The high frequency performance of all active and passive devices in a production 22nm FDSOI CMOS technology was measured up to 40 GHz over temperature down to 3.3 Kelvin, targeting applications in cryogenic and quantum computing ICs. It was found that the quality factor of the passives and the f T and f MAX of both p- and n-MOSFETs improved at 3.3 K. More importantly for circuit design, the peakf T and peak-f MAX current densities, and the MOM capacitor and polysilicon resistor values show no variance with temperature. This information and the measured I-V characteristics of electron and hole single- and double-quantum dot structures, measured at 2 K and representative of qubits, were used to design monolithically integrated double quantum dots with readout transimpedance amplifiers output matched to 50 Ω. Transimpedance gain, S 21 , and bandwidth of 108 dBΩ, 19 dB, and 7.5 GHz, respectively, were measured at 300 K with only 4.5 mW power consumption and S 22 < -10 dB up to 60 GHz.