학술논문

Condition Monitoring System and Faults Detection for Impedance Bonds from Railway Infrastructure
Document Type
article
Source
Applied Sciences, Vol 10, Iss 18, p 6167 (2020)
Subject
return circuit
monitoring device
sensors
diagnosis
thermal stress
Technology
Engineering (General). Civil engineering (General)
TA1-2040
Biology (General)
QH301-705.5
Physics
QC1-999
Chemistry
QD1-999
Language
English
ISSN
2076-3417
Abstract
Nowadays, sensors and condition monitoring systems are expanding rapidly and becoming cheaper. This contributes to increasing developments in condition monitoring in railway transport infrastructure. A condition monitoring system that uses an online device and sensors to acquire electrical parameters from railway infrastructure has been developed and applied for fault detection and diagnosis of impedance bonds. The impedance bond condition is monitored in real-time using current and temperature sensors, providing early warning if predefined thresholds are exceeded in terms of currents, imbalance currents, and temperatures. The proposed method and the developed monitoring device have been validated in the railway laboratory to confirm its capability to detect defects. The acquired parameters from impedance bonds are used to extract thermal stresses and technical conditions of this equipment. Experimental results and appropriate data analysis are included in the article.