학술논문

The Roadmap of 2D Materials and Devices Toward Chips
Document Type
article
Source
Nano-Micro Letters, Vol 16, Iss 1, Pp 1-96 (2024)
Subject
Two-dimensional materials
Roadmap
Integrated circuits
Post-Moore era
Technology
Language
English
ISSN
2311-6706
2150-5551
Abstract
Highlights This review introduces the potential of 2D electronics for post-Moore era and discusses their current progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence chips, and quantum chips in sequence. A comprehensive analysis of the current trends and challenges encountered in the development of 2D materials is summarized. An in-depth roadmap outlining the future development of 2D electronics is presented, and the most accessible and promising avenues for 2D electronics are suggested.