학술논문
Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys: Paper presented at the 'International Conference on Processing and Characterization of Materials 2018, ICPCM 2018', 6–8 December 2018, Rourkela, India
Document Type
research-article
Author
Source
International Journal of Materials Research. 110(12):1150-1159
Subject
Language
English
ISSN
2195-8556
1862-5282
1862-5282
Abstract
This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy.