학술논문
The LHCb VELO Upgrade Module Construction
Document Type
Working Paper
Author
Akiba, K.; Alexander, M.; Bertella, C.; Biolchini, A.; Bitadze, A.; Bogdanova, G.; Borghi, S.; Bowcock, T. J. V.; Bridges, K.; Brock, M.; Burke, A. T.; Buytaert, J.; Byczynski, W.; Carroll, J.; Coco, V.; Collins, P.; Davis, A.; Francisco, O. De Aguiar; De Bruyn, K.; De Capua, S.; De Roo, K.; Doherty, F.; Douglas, L.; Dufour, L.; Dumps, R.; Dutta, D.; Eklund, L.; Elvin, A.; Farry, S.; Prieto, A. Fernandez; Lima, V. Franco; Freestone, J.; Fuzipeg, C.; Galati, M. D.; Torreira, A. Gallas; Geertsema, R. E.; Gersabeck, E.; Gersabeck, M.; Grant, F.; Halewood-leagas, T.; Hennessy, K.; Hulsbergen, W.; Hutchcroft, D.; Hynds, D.; Jans, E.; John, D.; John, M.; Jurik, N.; Ketel, T.; Klaver, S.; Kopciewicz, P.; Kostiuk, I.; Kraan, M.; Langstaff, M.; Latham, T.; Leflat, A.; Cid, E. Lemos; Lukashenko, V.; Merk, M.; Milovanovic, M.; Monk, M.; Murray, D.; Nasteva, I.; Oblakowska-Mucha, A.; Pajero, T.; Parkes, C.; Alvarez, A. Pazos; Trigo, E. Perez; Perry, M.; Reiss, F.; Rinnert, K.; Rodriguez, E. Rodriguez; Rovekamp, J.; Sanders, F.; Smead, L. G. Scantlebury; Schiller, M.; Shears, T.; Smith, N. A.; Snoch, A.; Svihra, P.; Szumlak, T.; van Beuzekom, M.; van Overbeek, M.; Regueiro, P. Vazquez; Volkov, V.; Wormald, M.; Zunica, G.
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Subject
Language
Abstract
The LHCb detector has undergone a major upgrade for LHC Run 3. This Upgrade I detector facilitates operation at higher luminosity and utilises full-detector information at the LHC collision rate, critically including the use of vertex information. A new vertex locator system, the VELO Upgrade, has been constructed. The core element of the new VELO are the double-sided pixelated hybrid silicon detector modules which operate in vacuum close to the LHC beam in a high radiation environment. The construction and quality assurance tests of these modules are described in this paper. The modules incorporate 200 \mum thick, n-on-p silicon sensors bump-bonded to 130 \nm technology ASICs. These are attached with high precision to a silicon microchannel substrate that uses evaporative CO$_2$ cooling. The ASICs are controlled and read out with flexible printed circuits that are glued to the substrate and wire-bonded to the chips. The mechanical support of the module is given by a carbon fibre plate, two carbon fibre rods and an aluminium plate. The sensor attachment was achieved with an average precision of 21 $\mathrm{\mu m}$, more than 99.5\% of all pixels are fully functional, and a thermal figure of merit of 3 \mathrm{Kcm^{2}W^{-1}}$ was achieved. The production of the modules was successfully completed in 2021, with the final assembly and installation completed in time for data taking in 2022.