학술논문
Nanoscale Three-Dimensional Imaging of Integrated Circuits using a Scanning Electron Microscope and Transition-Edge Sensor Spectrometer
Document Type
Working Paper
Author
Nakamura, Nathan; Szypryt, Paul; Dagel, Amber L.; Alpert, Bradley K.; Bennett, Douglas A.; Doriese, W. Bertrand; Durkin, Malcolm; Fowler, Joseph W.; Fox, Dylan T.; Gard, Johnathon D.; Goodner, Ryan N.; Harris, J. Zachariah; Hilton, Gene C.; Jimenez, Edward S.; Kernen, Burke L.; Larson, Kurt W.; Levine, Zachary H.; McArthur, Daniel; Morgan, Kelsey M.; O'Neil, Galen C.; Ortiz, Nathan J.; Pappas, Christine G.; Reintsema, Carl D.; Schmidt, Daniel R.; Schultz, Peter A.; Thompson, Kyle R.; Ullom, Joel N.; Vale, Leila; Vaughan, Courtenay T.; Walker, Christopher; Weber, Joel C.; Wheeler, Jason W.; Swetz, Daniel S.
Source
Subject
Language
Abstract
X-ray nanotomography is a powerful tool for the characterization of nanoscale materials and structures, but is difficult to implement due to competing requirements on X-ray flux and spot size. Due to this constraint, state-of-the-art nanotomography is predominantly performed at large synchrotron facilities. We present a laboratory-scale nanotomography instrument that achieves nanoscale spatial resolution while changing the limitations of conventional tomography tools. The instrument combines the electron beam of a scanning electron microscope (SEM) with the precise, broadband X-ray detection of a superconducting transition-edge sensor (TES) microcalorimeter. The electron beam generates a highly focused X-ray spot in a metal target held micrometers away from the sample of interest, while the TES spectrometer isolates target photons with high signal-to-noise. This combination of a focused X-ray spot, energy-resolved X-ray detection, and unique system geometry enable nanoscale, element-specific X-ray imaging in a compact footprint. The proof-of-concept for this approach to X-ray nanotomography is demonstrated by imaging 160 nm features in three dimensions in 6 layers of a Cu-SiO2 integrated circuit, and a path towards finer resolution and enhanced imaging capabilities is discussed.