학술논문
Microchannel cooling for the LHCb VELO Upgrade I
Document Type
Working Paper
Author
Francisco, Oscar Augusto De Aguiar; Byczynski, Wiktor; Akiba, Kazu; Bertella, Claudia; Bitadze, Alexander; Brock, Matthew; Bulat, Bartosz; Button, Guillaume; Buytaert, Jan; De Capua, Stefano; Callegari, Riccardo; Castellana, Christine; Catinaccio, Andrea; Charrier, Catherine; Charvet, Collette; Coco, Victor; Collins, Paula; Degrange, Jordan; Dumps, Raphael; Feito, Diego Alvarez; Freestone, Julian; Jedrychowski, Mariusz; Lima, Vinicius Franco; Gallas, Abraham; Hulsbergen, Wouter; Hynds, Daniel; Izquierdo, Gonzalo Arnau; Jalocha, Pawel; Jan, Eddy; John, Malcolm; Jurik, Nathan; Leflat, Alexander; Cid, Edgar Lemos; Lindner, Rolf; Mapelli, Alessandro; Noel, Jerome; Nomerotski, Andrei; de Oliveira, Rui; van Overbeek, Martijn; Parkes, Chris; Petagna, Paolo; Porret, Alexandre; Renaud, Denis; Roeland, Erno; Romagnoli, Giulia; Rouchouze, Eric; de Roo, Krista; Sanders, Freek; Schneider, Thomas; Schindler, Heinrich; Schmidt, Burkhard; Schopper, Andreas; Scantlebury-Smead, Luke; Van Stenis, Miranda; Svihra, Peter; Teissandier, Benoit; Teissier, Jean-Francois; Thery, Xavier; Thomas, Eric; Verlaat, Bart
Source
Subject
Language
Abstract
The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon microchannel coolers with internally circulating bi-phase \cotwo for thermal control of hybrid pixel modules operating in vacuum. This is the largest scale application of this technology to date. Production of the microchannel coolers was completed in July 2019 and the assembly into cooling structures was completed in September 2021. This paper describes the R\&D path supporting the microchannel production and assembly and the motivation for the design choices. The microchannel coolers have excellent thermal peformance, low and uniform mass, no thermal expansion mismatch with the ASICs and are radiation hard. The fluidic and thermal performance is presented.
Comment: 31 pages, 27 figures
Comment: 31 pages, 27 figures