부산대학교 도서관

This letter presents a new compact chip-to-chip wire bonding technique which significantly improves the performance over conventional wire bonding techniques by using ground cross-over wires. The new concept is compared to conventional coplanar wire-bonding approaches by lumped-element analysis, full 3D FEM simulations, and experimentally verified by prototype measurements. The experimental results match well with the simulations. The new cross-over wire-bonding improves the measured insertion loss to 0.1–0.5-dB relative to 1.0–2.7-dB achieved without the cross-over wire-bonding, across the entire 75-110-GHz band, and the measured return loss is improved to levels well below −10-dB over the frequency band.