학술논문

Ion and neutral transportation consideration in etching of thin Si3N4 in high aspect ratio structures for aspect ratio independent etching.
Document Type
Article
Source
Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; May/Jun2006, Vol. 24 Issue 3, p1292-1296, 5p, 1 Black and White Photograph, 1 Diagram, 5 Graphs
Subject
IONS
ETCHING
THIN films
RADICALS (Chemistry)
SURFACE chemistry
Language
ISSN
10711023
Abstract
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